Gas barrier laminate, semiconductor device, display element, display device, and system

ABSTRACT

A gas barrier laminate includes a substrate and a barrier layer formed on at least one of faces of the substrate. The barrier layer includes composite oxide including silicon and alkaline-earth metal.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims the benefit of priority under 35 U.S.C. §119 of Japanese Patent Application No. 2015-239180 filed on Dec. 8,2015, the entire contents of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The disclosures herein generally relate to a gas barrier laminate, asemiconductor device, a display element, a display device, and a system.

2. Description of the Related Art

A high level of gas barrier property is demanded for the substrate inthe fields of electronic devices such as displays, lighting devices, andsolar batteries, in addition to several physical properties includingtransparency, heat resistance, solvent resistance, and interlayeradhesion. For this reason, the provision of a barrier layer having a gasbarrier property between the substrate and a semiconductor element isstudied.

As an example of obtaining a gas barrier property, there is a techniqueof depositing a resin layer containing a main component ofpolyorganosilsesquioxane on at least one of plastic films, and formingan inorganic compound layer including any one of silicon oxide, siliconoxide/nitride, oxidized silicon carbide, silicon carbide, siliconnitride, and silicon dioxide in the resin layer, so as to obtain a gasbarrier laminate (for example, see Japanese Unexamined PatentApplication Publication No. 2006-123307).

SUMMARY OF THE INVENTION

In one embodiment, a gas barrier laminate includes a substrate and abarrier layer formed on at least one of faces of the substrate. Thebarrier layer includes composite oxide including silicon andalkaline-earth metal.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of a gas barrier laminate in a firstembodiment;

FIG. 2 is a cross-sectional view of a field-effect transistor in thefirst embodiment;

FIG. 3A to FIG. 3E are views of the processes for manufacturing thefield-effect transistor in the first embodiment;

FIG. 4 is a first cross-sectional view of the field-effect transistor ina variation of the first embodiment;

FIG. 5 is a second cross-sectional view of the field-effect transistorin another variation of the first embodiment;

FIG. 6 is a third cross-sectional view of the field-effect transistor inyet another variation of the first embodiment;

FIG. 7 is a block diagram of a configuration of a television apparatusin a second embodiment;

FIG. 8 illustrates the television apparatus in the second embodiment;

FIG. 9 illustrates the television apparatus in the second embodiment;

FIG. 10 illustrates the television apparatus in the second embodiment;

FIG. 11 illustrates a display element in the second embodiment;

FIG. 12 illustrates an organic EL element in the second embodiment;

FIG. 13 illustrates the television apparatus in the second embodiment;

FIG. 14 illustrates another display element in the second embodiment;and

FIG. 15 illustrates yet another display element in the secondembodiment.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

It is a general object of at least one embodiment of the presentinvention to provide a gas barrier laminate, a semiconductor device, adisplay element, a display device, and a system that substantiallyobviate one or more problems caused by the limitations and disadvantagesof the related art.

In the following, embodiments of the present invention will be describedwith reference to the accompanying drawings. In the drawings, identicalcomponents have identical numerical references, and overlappingdescription is omitted, in some cases.

First Embodiment

<Gas Barrier Laminate>

FIG. 1 is a cross-sectional view of a gas barrier laminate in a firstembodiment. Referring to FIG. 1, a gas barrier laminate 10 includes asubstrate 11, and a barrier layer 12.

The substrate 11 is an insulating member, and serves as a base body forforming the barrier layer 12. The shape, structure, and size of thesubstrate 11 are not particularly limited, and may be selected for thepurpose as needed. The material of the substrate 11 is not particularlylimited. The material of the substrate 11 may be either a rigid materialor a flexible material (i.e. a material having flexibility), and may beselected for the purpose as needed. Specific examples will be given asfollows.

For example, a glass substrate or a plastic substrate can be used forthe substrate 11. There is no particular limitation to the glasssubstrate, and any glass substrate may be selected for the purpose asneeded. Examples of the glass substrate may include, but are not limitedto, alkali-free glass, and silica glass. There is no particularlimitation to the plastic substrate, and any plastic substrate may beselected for the purpose as needed. Examples of the plastic substratemay include, but are not limited to, polycarbonate (PC), polyimide (PI),polyethylene terephthalate (PET), and polyethylene naphthalate (PEN).

The barrier layer 12 is formed on at least one of faces of the substrate11. The barrier layer 12 may be formed on both faces of the substrate11. The barrier layer 12 is a layer that blocks the flow of gas (i.e.,gaseous substance) such as oxygen or water vapor. For example, whensemiconductor elements are mounted on the barrier layer 12, the barrierlayer 12 prevents oxygen or water vapor from reaching the semiconductorelements from the substrate 11 side. There is no particular limitationto the average thickness, and any average thickness of the barrier layer12 may be selected for the purpose as needed.

The barrier layer 12 includes composite oxide containing silicon andalkaline-earth metal. Such a barrier layer 12 improves the linearexpansion coefficient more than the linear expansion coefficient of aknown barrier layer including SiO₂. Therefore, the barrier layer 12 isachieved that hardly suffers from minute defects such as cracks,peelings, and pin holes, which are caused by, for example, expansion andcontraction of the substrate 11 in accordance with a change intemperature. In addition, as being excellent in transparency and heatresistance, the composite oxide including silicon and alkaline-earthmetal is applicable to a semiconductor device, for example, a thin-filmtransistor.

The alkaline-earth metal included in the composite oxide can be, forexample, at least one of Al, B, Mg, Ca, Sr, and Ba. Alternatively, thecomposite oxide can include some (or all) Al, B, Mg, Ca, Sr, and Ba. Thecomposite oxide may include at least one of Al and B.

<Field-Effect Transistor>

Herein, as an example of using a gas barrier laminate, a field-effecttransistor produced on the gas barrier laminate will be described.

FIG. 2 is a cross-sectional view of a field-effect transistor in thefirst embodiment. Referring to FIG. 2, a field-effect transistor 20includes a gas barrier laminate 10, an active layer 21, a sourceelectrode 22, a drain electrode 23, a gate insulating layer 24, and agate electrode 25. The field-effect transistor 20 is a top-gatetop-contact field-effect transistor. Note that the field-effecttransistor 20 is a representative example of the semiconductor device inone or more embodiments.

In the field-effect transistor 20, the active layer 21 is formed on thebarrier layer 12 having an insulating property, in the gas barrierlaminate 10. The source electrode 22 and the drain electrode 23 areformed on the active layer 21 so as to form a channel in the activelayer 21. The gate insulating layer 24 is formed to cover the activelayer 21, the source electrode 22, and the drain electrode 23. The gateelectrode 25 is formed on the gate insulating layer 24. Hereinafter, thecomponent elements of the field-effect transistor 20 will be describedin detail.

In the present embodiment, for the sake of simplicity, the gateelectrode 25 side is referred to as an upper side or a first side,whereas the substrate 11 side is referred to as a lower side or a secondside. In addition, the face on the gate electrode 25 side in each layeris referred to as an upper side or a first side, whereas the face on thesubstrate 11 side is referred to as a lower side or a second side. Thefield-effect transistor 20 can also be used upside down, or can bearranged at any angle. In addition, a planar view means a view when atarget object is viewed in the normal direction of the upper face of thesubstrate 11. A planar shape means a shape when the target object isviewed in the normal direction of the upper face of the substrate 11.Further, a longitudinal section means a section taken along a stackeddirection of the layers on the substrate 11. A transverse section meansa section taken along a perpendicular direction to the stacked directionof the layers on the substrate 11 (i.e., a direction parallel to topface of the substrate 11).

The active layer 21 is formed in a given region of the barrier layer 12.The active layer 21 can be a layer including, for example, an oxidesemiconductor. With regard to oxide semiconductor, for example, ann-type oxide semiconductor can be used. In this case, there is noparticular limitation to the n-type oxide semiconductor, and any n-typeoxide semiconductor may be selected for the purpose as needed. Examplesof the n-type oxide semiconductor may include, but are not limited to,an Mg—In based oxide semiconductor and an In based oxide semiconductor.There is no particular limitation to the average thickness, and anyaverage thickness of the active layer 21 may be selected for the purposeas needed. The average thickness of the active layer 21 may be 1nanometer to 200 nanometers. The average thickness of the active layer21 may be 5 nanometers to 100 nanometers.

The source electrode 22 and the drain electrode 23 are formed on thebarrier layer 12. The source electrode 22 and the drain electrode 23partially cover the active layer 21. The source electrode 22 and thedrain electrode 23 are spaced apart from each other at a given intervalfor a channel region. The source electrode 22 and the drain electrode 23make electrical current available in accordance with the gate voltageapplied to the gate electrode 25. Together with the source electrode 22and the drain electrode 23, interconnections to be respectively coupledto the source electrode 22 and the drain electrode 23 are formed on thesame layer.

There is no particular limitation to the materials for the sourceelectrode 22, the drain electrode 23, and the interconnections, and anymaterial may be selected for the purpose as needed. Examples of thematerial may include, but are not limited to, metals such as Al, Au, Pt,Pd, Ag, Cu, Zn, Ni, Cr, Ta, Mb, Ti, alloys of these metals, and mixturesof these metals. Alternatively, conductive oxide such as indium oxide,zinc oxide, tin oxide, gallium oxide, niobium oxide, a complex compoundof those conductive oxides, or a mixture of those oxides can be used.

There is no particular limitation to the average thicknesses of thesource electrode 22, the drain electrode 23, and the interconnections,and any average thickness may be selected for the purpose as needed. Theaverage thicknesses of the source electrode 22, the drain electrode 23,and the interconnections may be 40 nanometers to 2 micrometers. Theaverage thicknesses of the source electrode 22, the drain electrode 23,and the interconnections may be 70 nanometers to 1 micrometer.

The gate insulating layer 24 covers the active layer 21, the sourceelectrode 22, and the drain electrode 23. The gate insulating layer 24is formed over the barrier layer 12. The gate insulating layer 24insulates the source electrode 22 and the drain electrode 23 from thegate electrode 25. The material of the gate insulating layer 24 is notparticularly limited, and any material may be selected for the purposeas needed. For example, an inorganic insulating material or an organicinsulating material can be used.

Examples of the inorganic insulating material may include, but are notlimited to, silicon oxide, alumina, tantalum oxide, titanium oxide,yttrium oxide, lanthanum oxide, hafnium oxide, zirconium oxide, siliconnitride, aluminum nitride, and mixtures of the above materials. Examplesof the organic insulating material may include, but are not limited to,polyimide, polyamide, polyacrylate, polyvinyl alcohol, and novolakresin. The average thickness of the gate insulating layer 24 is notparticularly limited, and any average thickness may be selected for thepurpose as needed. The average thickness of the gate insulating layer 24may be 50 nanometers to 3 micrometers. The average thickness of the gateinsulating layer 24 may be 100 nanometers to 1 micrometer.

The barrier layer 12 included in the gas barrier laminate 10 is aninsulating layer, and the gate insulating layer 24 may have the samecomposition as the composition of the barrier layer 12. To be specific,the gate insulating layer 24 may include composite oxide includingsilicon and alkaline-earth metal.

The barrier layer 12 is in partial contact with the gate insulatinglayer 24. Both the barrier layer 12 and the gate insulating layer 24having the same composition improve the adhesion property between thebarrier layer 12 and the gate insulating layer 24. In addition, both thebarrier layer 12 and the gate insulating layer 24 having the samecomposition reduce a possibility of a defect produced at a boundarybetween the barrier layer 12 and the gate insulating layer 24. Inparticular, in a top-gate field-effect transistor, the barrier layer 12and the gate insulating layer 24 completely cover the active layer 21.The gas barrier property to block the flow of the active layer 21 isimproved, accordingly.

The gate electrode 25 is stacked above the active layer 21 through thegate insulating layer 24. The gate electrode 25 applies a gate voltage.The material of the gate electrode 25 is not particularly limited, andany material may be selected for the purpose as needed. For example, thesame material as the material of the source electrode 22 or the drainelectrode 23 can be used. The average thickness of the gate electrode 25is not particularly limited, and any average thickness may be selectedfor the purpose as needed. The average thickness of the gate electrode25 may be 40 nanometers to 2 micrometers. The average thickness of thegate electrode 25 may be 70 nanometers to 1 micrometer.

<Method for Manufacturing Field-Effect Transistor>

Next, a method for manufacturing the field-effect transistor illustratedin FIG. 2 will be described. FIG. 3A to FIG. 3E are views of theprocesses for manufacturing the field-effect transistor in the firstembodiment.

Firstly, in the process of FIG. 3A, the gas barrier laminate 10 isproduced. To be specific, the substrate 11 including a glass substrateor a plastic substrate is prepared at first. Then, the barrier layer 12including the composite oxide including silicon and alkaline-earth metalis formed on the substrate 11. To form the barrier layer 12, forexample, a coating liquid of the composite oxide including silicon andalkaline-earth metal is produced. The coating liquid is applied on thesubstrate 11. Then, drying and baking processes are conducted at giventemperatures. In order to clean the surface of the substrate 11 andimprove the adhesion property of the substrate 11, preprocessing usingoxygen plasma or ultraviolet ozone, or ultraviolet irradiation cleaningmay be conducted before the barrier layer 12 is formed.

Next, in the process of FIG. 3B, the active layer 21 is formed on thebarrier layer 12 of the gas barrier laminate 10. In order to form theactive layer 21, firstly, a layer including an oxide semiconductor isformed on the active layer 21 by sputtering, for example. The materialof the oxide semiconductor can be selected for the purpose as needed, asdescribed above. For example, an Mg—In based oxide semiconductor can beused. When the Mg—In based oxide semiconductor is used for the oxidesemiconductor, for example, a polycrystalline fired body including acomposition of In₂MgO₄ can be used for a target. In addition, thearrived vacuum degree in a sputtering chamber or the flow rates of argongas and oxygen gas flowing at the time of sputtering may be adjusted fora suitable total pressure. After the oxide semiconductor is formed onthe substrate 11, the oxide semiconductor is patterned by, for example,photolithography and etching. The active layer 21 having a predeterminedshape is formed.

In the process of FIG. 3C, the source electrode 22 and the drainelectrode 23 are formed on the active layer 21. In order to form thesource electrode 22 and the drain electrode 23, a metal film that coversthe active layer 21 is firstly formed on the barrier layer 12 by avacuum deposition method. Then, the metal film that has been formed ispatterned by, for example, photolithography and etching. The sourceelectrode 22 and the drain electrode 23 having predetermined shapes areformed.

The materials of metals that are formed to be the source electrode 22and the drain electrode 23, and the thickness of the source electrode 22or the drain electrode 23, can be selected as needed, as describedabove. In this process, the interconnections to be coupled to the sourceelectrode 22 and the drain electrode 23 are also formed on the activelayer 21, together with the source electrode 22 and the drain electrode23.

Next, in the process of FIG. 3D, the gate insulating layer 24 is formedon the barrier layer 12. The gate insulating layer 24 covers the activelayer 21, the source electrode 22, and the drain electrode 23. The gateinsulating layer 24 can be formed by, for example, a plasma ChemicalVapor Deposition (CVD) method. The material and the thickness of thegate insulating layer 24 can be selected as needed, as described above.

Next, in the process of FIG. 3E, the gate electrode 25 is formed on thegate insulating layer 24. In order to form the gate electrode 25, ametal film is firstly formed on the gate insulating layer 24 by, forexample, a vacuum deposition method. Then, the metal film that has beenformed is patterned by, for example, photolithography and etching. Thegate electrode 25 having a predetermined shape is formed. The materialand the thickness of the gate electrode 25 can be selected as needed, asdescribed above.

In the above-described processes, the field-effect transistor 20 of atop-gate top-contact type illustrated in FIG. 2 can be manufactured.

As described above, in the field-effect transistor 20 in the firstembodiment, the layers including the active layer 21 are formed on thegas barrier laminate 10. This configuration prevents oxygen or watervapor from reaching the active layer 21 side from the substrate 11 side.As a result, performance degradation of the field-effect transistor 20is prevented.

In addition, the barrier layer 12 includes the composite oxide includingsilicon and alkaline-earth metal. This configuration improves the linearexpansion coefficient more than the linear expansion coefficient of aknown barrier layer made SiO₂ and other materials. This configurationalso achieves the barrier layer 12 that hardly suffers from minutedefects such as cracks, peelings, and pin holes, which are caused by,for example, expansion and contraction of the substrate 11 in accordancewith a change in temperature. As a result, degradation in the gasbarrier property of the barrier layer 12 is prevented over time. Theperformance of the field-effect transistor 20 is maintained for a longtime.

Further, also in a case where the substrate 11 is a flexible film-shapedsubstrate, the barrier layer 12 has a high linear expansion coefficient,and follows the expansion and contraction of the substrate 11.Therefore, the barrier layer 12 hardly suffers from a minute defect. Asa result, degradation in the gas barrier property of the barrier layer12 is prevented over time. The performance of the field-effecttransistor 20 is maintained for a long time.

Variations of First Embodiment

In variations of the first embodiment, examples of the field-effecttransistor having different layer structures from the structure of thefield-effect transistor in the first embodiment will be described. Invariations of the first embodiment, descriptions of same components asthe components that have been described above are omitted, in somecases.

FIG. 4 to FIG. 6 are cross-sectional views of the field-effecttransistors in variations of the first embodiment.

A field-effect transistor 20A illustrated in FIG. 4 is a top-gatebottom-contact field-effect transistor. A field-effect transistor 20Billustrated in FIG. 5 is a bottom-gate top-contact field-effecttransistor. A field-effect transistor 20C illustrated in FIG. 6 is abottom-gate bottom-contact field-effect transistor. The field-effecttransistors 20A to 20C are representative examples of the semiconductordevices in variations of the first embodiment.

The field-effect transistor formed on the gas barrier laminate 10 is notlimited to a top-gate top-contact field-effect transistor, and may be atop-gate bottom-contact field-effect transistor, a bottom-gatetop-contact field-effect transistor, or a bottom-gate bottom-contactfield-effect transistor. Also in those cases, the same advantages as thefirst embodiment are achievable.

Examples 1 to 4

In each one of Examples 1 to 4, the barrier layer 12 of the gas barrierlaminate 10 illustrated in FIG. 1 is produced to have a differentcomposition. In Examples 1 to 4 below, “%” represents “percent by mass”,if not otherwise specified.

<Production of Coating Liquid Used for Forming Barrier Layer 12>

The amounts indicated in Table 1 were mixed into a solution containingTetramethoxysilane (T5702-100G, Aldrich), aluminum (s-butoxide)diacetoacid ester chelate (containing 8.4% of Al, Alfa89349, AlfaAesar), boric acid triisopropyl (Wako320-41532, Wako Chemical Ltd.),2-ethylhexanoic acid calcium mineral spirit solution (containing 5% ofCa, Wako351-01162, Wako Chemical Ltd.), and 2-ethylhexanoic acidstrontium toluene solution (containing 2% of Sr, Wako 195-09561, WakoPure Chemical Industries, Ltd.). The mixed solution was then diluted bytoluene, and the coating liquid used for forming the barrier layer 12was obtained. The composite oxide formed with the coating liquid usedfor forming the barrier layer 12 had compositions indicated in Table 1below.

<Appearance Inspection>

The coating liquid of 0.4 milliliters used for forming the barrier layer12 was applied on the substrate 11. Subsequently, a drying process wasconducted in the air at 120 degrees Celsius for one hour. Then, a bakingprocess was conducted under O₂ atmosphere at 400 degrees Celsius forthree hours. The barrier layer 12 of a composite oxide film includingSiO₂—Al₂O₃—B₂O₃—CaO—SrO was formed. The average thickness of the barrierlayer 12 was approximately 30 nanometers. At the end, a heating processwas conducted at 320 degrees Celsius for 30 minutes. Then, theappearance was evaluated. The results are indicated in Table 1 below.

<Formation of Capacitor for Measuring Relative Permittivity>

Firstly, a lower electrode was formed on the substrate. To be specific,a molybdenum (Mo) film was deposited by DC sputtering through a metalmask to have the average thickness of 100 nanometers. Then, the coatingliquid used for forming the barrier layer 12 in each Example was used toform a dielectric layer in the same process as described above. At theend, an upper electrode was formed on the dielectric layer in the sameprocess as the process of forming the lower electrode. Thus, a capacitorwas formed. The dielectric layer had the average thickness ofapproximately 30 nanometers. The capacitor was formed as described aboveand then the relative permittivity was measured by an LCR meter (4284A,Agilent). The results are indicated in Table 1.

<Production of Sample for Measuring Linear Expansion Coefficient>

The coating liquid of one liter used for forming the barrier layer 12 ineach Example was produced. The solvent was eliminated, a heating processwas conducted in a Pt crucible at 1600 degrees Celsius, and meltingoccurred. Then, a columnar object having a diameter of 5 millimeters anda height of 10 millimeters was produced by a float method. The averagelinear expansion coefficient of the columnar object in a temperaturerange of 20 degrees Celsius to 300 degrees Celsius was measured by athermal mechanical analyzer (8310 series, Rigaku Corporation). Theproduced columnar object had the same composition as the composition ofa case where the coating liquid used for forming the barrier layer 12was deposited on either one of the faces of the substrate, in each ofExamples. The produced columnar object also had the same linearexpansion coefficient. The results are indicated in Table 1.

TABLE 1 EXAMPLE 1 EXAMPLE 2 EXAMPLE 3 EXAMPLE 4 OXIDE OXIDE OXIDE OXIDEOXIDE OXIDE OXIDE OXIDE MASS MOLE MASS MOLE MASS MOLE MASS MOLE RATIORATIO RATIO RATIO RATIO RATIO RATIO RATIO OXIDE MASS % MOLE % MASS %MOLE % MASS % MOLE % MASS % MOLE % SiO₂ 61.0 67.5 62.8 70.0 50.9 60.362.3 70.3 Al₂O₃ 16.4 10.7 18.1 11.9 12.3 8.6 21.5 14.3 B₂O₃ 12.3 11.812.8 12.3 10.8 11.1 13.7 13.4 CaO 6.2 7.4 3.2 3.8 3.7 4.7 0.7 0.8 SrO4.0 2.6 3.1 2.0 22.3 15.3 1.8 1.2 TOTAL 100.0 100.0 100.0 100.0 100.0100.0 100.0 100.0 RELATIVE 5.5 5.0 6.0 4.8 PERMITTIVITY LINEAR 36.4 30.050.3 24.7 EXPANSION COEFFICIENT (×10⁻⁷/K) APPEARANCE NO PEELING NOPEELING NO PEELING NO PEELING

Comparison Example

<Appearance Inspection>

By using SiCl₄ as a material, a SiO₂ layer was formed on the substrate11 by a Plasma Enhance Chemical Vapor Deposition (PECVD) process. TheSiO₂ layer that was formed had the average thickness of approximately 30nanometers. At the end, a heating process was conducted at 320 degreesCelsius for 30 minutes. Then, the appearance was evaluated. The resultsare indicated in Table 2 below.

<Formation of Capacitor for Measuring Relative Permittivity>

Firstly, a lower electrode was formed on the substrate. To be specific,a molybdenum (Mo) film was deposited by DC sputtering through a metalmask to have the average thickness of 100 nanometers. Then, a dielectriclayer including a SiO₂ layer was formed in the same process as theprocess in each of Examples. At the end, an upper electrode was formedon the dielectric layer in the same process as the process of formingthe lower electrode, and thus a capacitor was formed. The dielectriclayer had the average thickness of approximately 30 nanometers. Thecapacitor was formed as described above and then the relativepermittivity was measured by an LCR meter (4284A, Agilent). The resultsare indicated in Table 2 below.

<Production of Sample for Measuring Linear Expansion Coefficient>

By using SiCl₄ as a material, a hydrolysis process was conducted inoxyhydrogen flame to grow silica powder, and a SiO₂ porous body wasobtained. Then, the SiO₂ porous body was melted at high temperature of1600 degrees Celsius. Columnar SiO₂ glass having a diameter of 5millimeters and a height of 10 millimeters was produced. The averagelinear expansion coefficient of the produced columnar SiO₂ glass in thetemperature range of 20 degrees Celsius to 300 degrees Celsius wasmeasured by the thermal mechanical analyzer (8310 series, RigakuCorporation). The results are indicated in Table 2.

TABLE 2 COMPARATIVE EXAMPLE OXIDE OXIDE MASS MOLE RATIO RATIO OXIDE MASS% MOLE % SiO₂ 100.0 100.0 Al₂O₃ — — B₂O₃ — — CaO — — SrO — — TOTAL 100.0100.0 RELATIVE 3.9 PERMITTIVITY LINEAR 5.0 EXPANSION COEFFICIENT(×10⁻⁷/K) APPEARANCE PEELED

As indicated in Table 1 and Table 2, in the comparative example, thelinear expansion coefficient was 5×10⁻⁷/K and peeling occurred. However,in Examples 1 to 4, the linear expansion coefficient was 24.7×10⁻⁷/K atthe lowest and peeling did not occur.

In other words, the barrier layer 12 including the composite oxideincluding silicon and alkaline-earth metal has approximately five timesor more the linear expansion coefficient of the SiO₂ layer in thecomparative example. These results exhibit that the barrier layer 12 inExamples 1 to 4 hardly suffers from minute defects such as cracks,peelings, and pin holes, which are caused by, for example, expansion andcontraction of the substrate in accordance with a change in temperature.In other words, the barrier layers 12 in Examples 1 to 4 are capable ofpreventing degradation in the gas barrier property.

Second Embodiment

In a second embodiment, examples of a display element, a display device,and a system, to each of which the field-effect transistor in the firstembodiment is applied, will be described. In the second embodiment,descriptions of the same components as the components that have beendescribed above are omitted, in some cases.

<Display Element>

The display element in the second embodiment includes at least anoptical control element, and a driving circuit configured to drive theoptical control element. In addition, the display element may includeother members, as needed. There is no particular limitation to theoptical control element. The optical control element may be any elementthat controls an optical output in response to a driving signal, and maybe selected for the purpose as needed. Examples of the optical controlelement may include, but are not limited to, an electroluminescence (EL)element, an electrochromic (EC) element, a liquid crystal element, anelectrophoresis element, and an electrowetting element.

There is no particular limitation to the driving circuit, and thedriving circuit may be any circuit that includes the field-effecttransistor in the first embodiment, and may be selected for the purposeas needed. There is no particular limitation to the other members, andthe other members may be selected for the purpose as needed.

The display element in the second embodiment includes the field-effecttransistor in the first embodiment. Therefore, degradation in gasbarrier property is prevented over time. The performance of thefield-effect transistor is maintained for a long time. As a result,high-quality display is enabled continuously.

<Display Device>

The display device in the second embodiment includes a plurality ofdisplay elements in the second embodiment, a plurality ofinterconnections, and a display controller. In addition, the displaydevice may include other members, as needed. There is no particularlimitation to the plurality of display elements, may be any displayelements arranged in a matrix in the second embodiment, and may beselected for the purpose as needed.

There is no particular limitation to the plurality of interconnections.The plurality of interconnections may be any interconnections capable ofindividually applying a gate voltage and a visual data signal to thefield-effect transistors in the display elements, and may be selectedfor the purpose as needed.

There is no particular limitation to the display controller, so thedisplay controller may be any display controller capable of individuallycontrolling the gate voltage and a signal voltage in each field-effecttransistor through the plurality of interconnections, and may beselected for the purpose as needed. There is no particular limitation tothe other members, and the other members may be selected for the purposeas needed.

The display device in the second embodiment includes the display elementincluding the field-effect transistor in the first embodiment. Hence,high-quality display is enabled continuously.

<System>

The system in the second embodiment includes at least the display devicein the second embodiment, and a visual data creator. The visual datacreator creates visual data in accordance with information on an imageto be displayed, and then outputs the visual data to the display device.

Since the system includes the display device in the second embodiment,high-definition display of the visual information is enabled.

Hereinafter, the display element, the display device, and the systemwill be described specifically.

FIG. 7 illustrates an outline configuration of a television apparatus500. The television apparatus 500 is an example of the system in thesecond embodiment. Connection lines in FIG. 7 indicate representativeflows of signals and information, but do not indicate all of theconnecting relationships between blocks.

The television apparatus 500 in the second embodiment includes a maincontroller 501, a tuner 503, an AD convertor (ADC) 504, a demodulatingcircuit 505, a Transport Stream (TS) decoder 506, an audio decoder 511,a DA converter (DAC) 512, an audio outputting circuit 513, a speaker514, a video decoder 521, a video and OSD synthesizing circuit 522, avideo outputting circuit 523, a display device 524, an OSD drawingcircuit 525, a memory 531, an operation device 532, a drive interface(drive IF) 541, a hard disk device 542, an optical disk device 543, anIR optical receiver 551, and a communication controller 552.

The main controller 501 controls the entire television apparatus 500.The main controller 501 includes a CPU, a flash ROM, a RAM, and someother components. Programs written in readable codes on the CPU andvarious data used for the processes on the CPU are stored in the flashROM. The RAM is a working memory.

The tuner 503 selects a broadcast of a predetermined channel frombroadcast waves that have been received by an antenna 610. The ADC 504converts an output signal (i.e., analog information) from the tuner 503into digital information. The demodulating circuit 505 demodulates thedigital information supplied from the ADC 504.

The TS decoder 506 performs a TS decoding process on the output signalsupplied from the demodulating circuit 505 to separate audio informationand video information. The audio decoder 511 decodes the audioinformation from the TS decoder 506. The DAC 512 converts the outputsignals from the audio decoder 511 into analog signals.

The audio outputting circuit 513 receives the output signal suppliedfrom the DAC 512, and then outputs the output signal to the speaker 514.The video decoder 521 decodes the video information supplied from the TSdecoder 506. The video and OSD synthesizing circuit 522 synthesizes theoutput signal supplied from the video decoder 521 and the output signalsupplied from the OSD drawing circuit 525.

The video outputting circuit 523 receives the output signal suppliedfrom the video and OSD synthesizing circuit 522, and then outputs theoutput signal to the display device 524. The OSD drawing circuit 525includes a character generator for displaying characters and figures onthe screen of the display device 524. The OSD drawing circuit 525generates a signal including display information in response to aninstruction from the operation device 532 or the IR optical receiver551.

Audio-Visual (AV) data and other data are temporarily accumulated in thememory 531. The operation device 532 includes an input medium, notillustrated, which is an example of a control panel. The operationdevice 532 informs the main controller 501 of various types ofinformation that have been input by a user. The drive IF 541 may be abidirectional communication interface. Such an interface complies withAT Attachment Packet Interface (ATAPI), for example.

The hard disk device 542 includes a hard disk, and a driving deviceconfigured to drive the hard disk. The driving device records data inthe hard disk, and plays the data recorded in the hard disk. The opticaldisk device 543 records data in an optical disk (e.g., DVD), and playsthe data recorded in the optical disk.

The IR optical receiver 551 receives an optical signal from a remotecontrol transmitter 620, and informs the main controller 501 of thereceived optical signal. The communication controller 552 controlscommunication with the Internet. The television apparatus 500 is capableof acquiring various types of information through the Internet.

As illustrated in FIG. 8, as an example, the display device 524 includesa display unit 700 and a display controller 780. As illustrated in FIG.9, as an example, the display unit 700 includes a display 710. In thedisplay 710, a plurality of display elements 702 are arranged in amatrix (here, the number of the display elements 702 can be representedby n×m).

As illustrated in FIG. 10, as an example, the display 710 includes nscanning lines (X0, X1, X2, X3, . . . , Xn−2, Xn−1), m data lines (Y0,Y1, Y2, Y3, . . . , Ym−1), and m current supplying lines (Y0i, Y1i, Y2i,Y3i, . . . , Ym−1i). The n scanning lines are arranged at equal intervalin X-axis direction. The m data lines are arranged at equal interval inY-axis direction. The m current supplying lines are arranged at equalinterval in Y-axis direction. Each one of the display elements 702 canbe identified by the scanning line and the data line.

As illustrated in FIG. 11, as an example, each one of the displayelements 702 includes an organic electroluminescence (EL) element 750,and a driving circuit 720 configured to cause the organic EL element 750to emit light. In other words, the display 710 is a so-called activematrix organic EL display. In addition, the display 710 may be acolor-supporting 32-inch display. The size is not limited to 32 inches.

As illustrated in FIG. 12, as an example, the organic EL element 750includes an organic EL thin-film layer 740, a cathode 712, and an anode714.

The organic EL element 750 can be arranged, for example, next to thefield-effect transistor. In this case, the organic EL element 750 andthe field-effect transistor can be formed on an identical substrate.However, the arrangement of the organic EL element 750 is not limited tothe above-described arrangement. For example, the organic EL element 750may be arranged on the field-effect transistor. In this case, thetransparency is demanded for the gate electrode. Therefore, transparentoxide having a conductive property, such as ITO, In₂O₃, SnO₂, ZnO, ZnOin which Ga is added, ZnO in which Al is added, and SnO₂ in which Sb isadded, can be used for the gate electrode.

In the organic EL element 750, aluminum (Al) may be used for a cathode712. Magnesium (Mg)—silver (Ag) alloy, aluminum (Al)—lithium (Li) alloy,or Indium Tin Oxide (ITO) may be used. ITO may be used for the anode714. Oxide having a conductive property such as In₂O₃, SnO₂, or ZnO, orsilver (Ag)—neodymium (Nd) alloy may be used.

The organic EL thin-film layer 740 includes an electron transportinglayer 742, a light-emitting layer 744, and a hole transporting layer746. The cathode 712 is coupled to the electron transporting layer 742,and the anode 714 is coupled to the hole transporting layer 746. When agiven voltage is applied between the cathode 712 and the anode 714, thelight-emitting layer 744 emits light.

As illustrated in FIG. 11, the driving circuit 720 includes twofield-effect transistors 810 and 820, and a capacitor 830. Thefield-effect transistor 810 operates as a switching element. The gateelectrode G is coupled to a given scanning line. The source electrode Sis coupled to a given data line. The drain electrode D is coupled to oneof the ends of the capacitor 830.

The capacitor 830 is configured to store the state of the field-effecttransistor 810, that is, the capacitor 830 is configured to store data.The other one of the ends of the capacitor 830 is coupled to a givencurrent supplying line.

The field-effect transistor 820 is configured to supply a large currentto the organic EL element 750. The gate electrode G is coupled to thedrain electrode D of the field-effect transistor 810. The drainelectrode D is coupled to the anode 714 of the organic EL element 750.The source electrode S is coupled to a given current supplying line.

When the field-effect transistor 810 turns into ON state, thefield-effect transistor 820 drives the organic EL element 750.

As illustrated in FIG. 13, as an example, the display controller 780includes a visual data processing circuit 782, a scanning line drivingcircuit 784, and a data line driving circuit 786.

The visual data processing circuit 782 determines the brightness of theplurality of display elements 702 on the display 710 in accordance withthe output signal supplied from the video outputting circuit 523. Thescanning line driving circuit 784 individually applies voltages on the nscanning lines in response to an instruction from the visual dataprocessing circuit 782. The data line driving circuit 786 individuallyapplies voltages on the m data lines in response to an instruction fromthe visual data processing circuit 782.

As is obvious from the above description, in the television apparatus500 in the second embodiment, the visual data creator includes the videodecoder 521, the video and OSD synthesizing circuit 522, the videooutputting circuit 523, and the OSD drawing circuit 525.

In the above description, the case where the optical control element isan organic EL element has been described. However, the optical controlelement is not limited to the organic EL element. The optical controlelement may be a liquid crystal element, an electrochromic element, anelectrophoresis element, and an electrowetting element.

In a case where the optical control element is a liquid crystal element,for example, a liquid crystal display is used for the display 710. Inthis case, as illustrated in FIG. 14, no current supplying line isnecessary in the display element 703.

Also in this case, as illustrated in FIG. 15, as an example, a drivingcircuit 730 can be configured with only one field-effect transistor 840,which has the same configuration as the configuration of thefield-effect transistor 810 or 820. In the field-effect transistor 840,the gate electrode G is coupled to a given scanning line. The sourceelectrode S is coupled to a given data line. The drain electrode D iscoupled to a pixel electrode of a liquid crystal element 770 and acapacitor 760. In FIG. 15, reference numerals 762 and 772 denoteopposite electrodes (i.e., common electrodes) of the capacitor 760 andthe liquid crystal element 770, respectively.

In the embodiments described above, the case where the system is atelevision apparatus has been described. However, the embodiments arenot limited to the above-described case. In short, the display device524 can be provided for displaying videos and information. For example,a computer system in which a computer (e.g., personal computer) and thedisplay device 524 are coupled to each other may be provided.

In addition, the display device 524 can be used for a display in amobile information device or an image-capturing device. Examples of themobile information device may include, but are not limited to, a mobiletelephone, a mobile music player, a mobile video player, an electronicbook, and a Personal Digital Assistant (PDA). Examples of theimage-capturing device may include, but are not limited to, a stillcamera and a video camera.

Further, the display device 524 can be used for a display device thatdisplays various types of information in a movable body system such as avehicle, an airplane, a train, or a ship.

Furthermore, the display device 524 can be used for a display devicethat displays various types of information in a measuring device,analyzer, a medical device, or an advertising medium.

Heretofore, embodiments have been described in detail. However, thepresent invention is not limited to these embodiments, but variousvariations and modifications may be made without departing from thescope of the present invention.

What is claimed is:
 1. A gas barrier laminate comprising: a substrate; abarrier layer formed on at least one of faces of the substrate, thebarrier layer including composite oxide including silicon andalkaline-earth metal; and a gate insulating layer of a semiconductordevice configured to be at least in partial contact with the barrierlayer, wherein the composite oxide is in at least partial contact withthe substrate.
 2. The gas barrier laminate according to claim 1, whereinthe composite oxide includes at least one of Al and B.
 3. The gasbarrier laminate according to claim 1, wherein the substrate has aflexible property.
 4. A semiconductor device comprising: the gas barrierlaminate of claim 1; a gate electrode configured to apply a gatevoltage; a source electrode and a drain electrode configured to makeelectrical current available in accordance with applying of the gatevoltage; and an active layer configured to form a channel between thesource electrode and the drain electrode, the gate insulating layerbeing arranged between the active layer and the gate electrode, and thegate electrode, the source electrode, the active layer, and the gateinsulating layer being arranged on the barrier layer of the gas barrierlaminate.
 5. The semiconductor device according to claim 4, wherein thebarrier layer and the gate insulating layer have an identicalcomposition.
 6. A display element comprising: the semiconductor deviceof claim 4; a driving circuit configured to output a driving signal; andan optical control element configured to control an optical output inresponse to the driving signal output from the driving circuit, whereinthe driving circuit drives the optical control element by thesemiconductor device.
 7. The display element according to claim 6,wherein the optical control element includes one of anelectroluminescence element, an electrochromic element, a liquid crystalelement, an electrophoresis element, and an electrowetting element.
 8. Adisplay device comprising: a display unit including a plurality of thedisplay elements of claim 6 arranged in a matrix; and a displaycontroller configured to individually control the plurality of thedisplay elements.
 9. A system comprising: the display device of claim 8;and a visual data creator configured to supply the display device withvisual data.